Bangalore (Karnataka) [India], September 12: FermionIC Design Pvt. Ltd., a fabless RFIC design company located in Bangalore, announced a strategic partnership with Tata Electronics today. The collaboration will provide advanced wafer-level testing, packaging, and post-silicon validation. This alliance is designed to support the production ramp-up of FermionIC’s indigenous and proprietary 4-Channel X-Band Beamformer IC, which was developed for next-generation TDD Phased Array Antennas.

This FD3R4411 Beamformer IC is a pioneering innovation from India, signifying a critical milestone for the nation’s semiconductor and radar technology ecosystem. By enabling the creation of compact, high-performance phased array systems, this chip serves the needs of applications such as ranging radars, imaging radars, and next-generation surveillance platforms. Already being adopted by a wide range of public and private organizations, the IC is accelerating India’s ability to develop its own phased array radar solutions.

As part of this partnership, Tata Electronics will serve as the Outsourced Semiconductor Assembly and Test (OSAT) partner. They will provide flip-chip ball grid array (FcBGA) assembly and wafer-level testing. This collaboration between FermionIC Design and Tata Electronics highlights the growing synergy between India’s semiconductor design innovators and their advanced manufacturing partners.

“Our partnership with Tata Electronics allows us to take this complex IC, which was fully designed and developed in India, from the design phase to staggered volume production on an expedited timeline, beginning in Q4 2025,” said Gautam Kumar Singh, CEO of FermionIC Design. “This also ensures that almost the entire manufacturing value chain remains within India.”